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datashee t product structure silicon monolithic integrated circuit ? this product has no designed protec tion against radioactive rays . 1/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 tsz22111 ~ 14~ 001 www.rohm.com ac/dc drivers power factor correction and quasi-resonant dc/dc converter ic BM1C001F general description the compounded lsi of the power factor correction (pfc) converter and quasi-resonant (qr) controller type ac/dc converter ic provides an optimum system for all products that include an electrical outlet. BM1C001F has a built in hv starter circuit that tolerates 650v and contributes to low power consumption and high speed start. the pfc part is a boundary conduction mode (bcm). it reduces the switching loss and the switching noise. this ic has adopted the voltage cont rol mode, a solution that achieves no auxiliary winding and reduces external parts and the bias current. the dc/dc part is quasi-resona nt controlled. this control enables soft switching and helps to keep the emi low. with mosfet for switching and curr ent detection resistors as external devices, a higher degree of design freedom is achieved. this ic has over voltage protection for the pfc?s output terminal, which protects electrolytic capacitors by stopping switching and makes the standby power consumption low by the pfc on/off control function. the ic includes various protective functions such as vcc over voltage protection, external latch protection, brown out protection, soft start function, per-cycle current lim iter and over load protection. features ? pfc+qr combo ic ? built-in 650v tolerance start circuit ? vcc pin: under and over voltage protection ? brown out function ? external latch terminal function ? pfc boundary current mode (voltage control) ? pfc zero cross detection ? pfc variable max frequency (up to 400khz) ? pfc dynamic & static ovp function ? pfc output level setting function ? pfc on/off level setting ? qr low power when load is light (burst operation) and frequency decrease function ? qr maximum frequency control (120khz) ? qr_cs pin open protection and ocp function ? qr over-current protection with ac compensation ? qr soft start function ? qr secondary side protection circuit of over-current ? qr_zt pin 2 step timeout function and ovp function applications ac adapters and household appliances (printer, tv, vacuum cleaners, air cleaners, air conditioners, ih cooking heaters, rice cookers, etc.). key specifications operating power supply: voltage range: vcc vh_in 8.9v to 26.0v 80v to 600v operating current: normal burst 1.2ma (typ) 0.6ma (typ) max frequency: pfc qr 400khz (max) 120khz (typ) the range of temperature: -40c to +85c package w(typ) x d(typ) x h(max) sop18 11.20mm 7.80mm 2.01mm ? pitch 1.27mm sop18 typical application circuit figure 1. application circuit BM1C001F 1 2 7 6 5 4 3 9 8 18 17 12 13 14 15 16 10 11 vh_in (n.c.) vcc gnd comp qr_fb p_vs qr_fb qr_out p_offset p_ovp p_vs rs pc csw p_is qr_cs p_timer p_eo p_out p_rt qr_zt p_is br vcc qr_cs qr_fb qr_zt 15.0v 5.0a br vcc qr_out qr_zt pc cpu br diode bridge ac 85-265 vac filter fuse error amp sbd qr_cs qr_out p_vs p_is
datasheet datasheet 2/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F pin configuration figure 2. pin layout (top view) pin description table 1. i/o pin functions esd diode pin name i/o pin no. function vcc gnd vcc i/o 1 [general] power supply pin - gnd i/o 2 [general] gnd pin - qr_fb i 3 [ qr ] feedback detection pin ? qr_zt i 4 [ qr ] zero cross detection pin - comp i 5 [general] external latch input pin ? p_eo o 6 [pfc] error amplifier output pin ? br i 7 [general] input ac voltage monitor pin ? p_rt i 8 [pfc] max frequency setting pin ? p_offset i 9 [pfc] on /off setting voltage ? p_ovp i 10 [pfc] over voltage detection pin ? p_vs i 11 [pfc] feedback signal input pin ? qr_cs i 12 [ qr ] over-current detection pin ? p_is i 13 [pfc] zero cross detection pin ?? p_out o 14 [pfc] external mos drive pin qr_out o 15 [ qr ] external mos drive pin p_timer i 16 [pfc] off time setting pin ? n.c. - 17 - - - vh_in i 18 [general] starter circuit pin -
datasheet datasheet 3/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F block diagram figure 3. block diagram
datasheet datasheet 4/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F description of blocks (1) starter block (vh_in pin) the built-in starter circuit tolerates 650v and enables low st andby mode current consumption and high speed starting. after starting, current consumption is idle i start3 (typ=10ua). this function is shown in figure 4 and figure 5. start up current [ma] figure 4. starter circuit block diagram figure 5. start-up current vs vcc voltage ? in addition, vh_in pin has a cap discharge function. (refer to figure 6). if the input voltage of the br pin goes below 1.0v, discharge starts after waiting 256ms. (however during light load mode, the olp state of the sec ondary side output, if there is no power supply from the auxiliary winding, when the ic is in recharge operation, discharge begins after removing the ac outlet without waiting for the timer (256ms), with the current cons umption of the internal circui try of the ic. (path: figure 6 (a))) figure 6. starter circuit block diagram
datasheet datasheet 5/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (2) start-up sequence (soft start operation, light load operation, ov er load operation, auto recovery operation) the start up sequence is showed at figure 7; the dc/dc part operates first, followed by the pfc part. a: input voltage vh_in is applied. b: charge current flows from start circuit to the vcc pin capacitor. then vcc pin voltage rises. c: monitor the ac voltage by br pin. and confirm normal state by releasing brown out (br pin>1.0v). d: when v uvlo1 (typ.13.5v) < vcc pin, uvlo is released and this ic operates. e: after rising, the internal regulator, dc/dc part, starts oper ation, and then vout voltage ri ses. when the dc/dc starts, the dc/dc output voltage is set to be the specified voltage to until t folp (typ.256ms). [qr start-up operation] f: this ic adjusts the over-current limit er of dc/dc part during the operation of soft start 1 against over voltage and current rising. this term continues for t ss1 (typ.0.5ms). this ic operates the state until maximum power of qr is 12%. g: this ic adjusts the over-current limit er of dc/dc part during the operation of soft start 2 against over voltage and current rising. this term continues for t ss2 (typ.1.0ms). this ic operates the state until maximum power of qr is 25%. h: this ic adjusts the over-current limiter of dc/dc part during the operation of soft start 3 against over voltage and current rising. this term continues for t ss2 (typ.2.0ms). this ic operates the state until maximum power of qr is 50%. i: this ic adjusts the over-current limit er of dc/dc part during the operation of soft start 4 against over voltage and current rising. this term continues for t ss2 (typ.4.0ms). this ic operates the state until maximum power of qr is 75%. j: if secondary voltage is value is set, the qr_fb voltage value corresponding to load current from photo coupler is constant. at normal state, qr_fb voltage is qr_fb2.25v, the output voltage rise is slow, then, p_vs is stable with voltage of 1.625v (acin l) or (a cin h) 2.5v by the input state of the br pin. vh_in vcc [brounout] ok ok [qr_ok] ok 250usec v uvlo1 (typ=13.5v) 0.5ms vo(qr) output setting voltage qr_fb pfc_ok ok output setting voltage vo(pfc) a b cdef j k l m p_vs p_vs=2.25v v p_short typ=0.30v v samp (typ=2.50v) [vccuvlo] v folp (typ=2.6v) dcdc 12% 1.0ms 50% 75% 25% 2.0ms br gh i 0.5ms normal operation figure 7. start-up sequence timing chart
datasheet datasheet 6/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (3) vcc pin protection function BM1C001F includes built-in v cc low voltage protection function, vcc uvlo (under voltage lock out), v cc over voltage protection function, vcc ovp (over vo ltage protection), and vcc charge functi on that operates in case the vcc voltage drops. vcc uvlo and vcc ovp m onitor the vcc pin and prevent the vcc pin from destroying the switching mosfet with abnormal voltage. vcc charge function stabilizes the secondary output voltage by charging it from the high voltage line using the starter circuit when the vcc voltage drops. (3-1) vcc uvlo ? vcc ovp function vcc uvlo is an auto recovery comparat or that has voltage hysteresis. vcc ovp is also an auto recovery comparator that has voltage hysteresis . vcc ovp operates detection in case of continuing vcc pin voltage > v ovp (typ.27.5v). this function has built-in mask time of t latch (typ.150us). by this function, th is ic masks pin generated surge etc. (3-2) vcc charge function vcc charge function operates once the vcc pin >v uvlo1 and the dc/dc operation starts and then when the vcc pin voltage drops to v chg2 , charging is stopped. the operations are shown in figure 8. figure 8. vcc uvlo / vcc ovp / vcc charge function timing chart a: vh _in pin voltage rises, vcc pin voltage starts rising. b: vcc > v uvlo1 , vcc uvlo is released, dc/dc operation starts. c: vcc > v ovp , vcc ovp detects the overvoltage in the ic. d: if the state of vcc < v ovp continued t latch (typ.100us) time, switching will stop by the ovp function. (latch mode). e: vcc < v chg1 , vcc terminal voltage rises by vcc recharging function. f: vcc > v chg2, vcc recharge function stops. g: (the same with e.) h: (the same with f.) i: voltage of the high voltage line vh is reduced j: vcc datasheet datasheet 7/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (4) comp pin (outside coercive stop function) the comp pin is used for coercive stop f unction. when the comp pin is lower than v comp (typ.0.5v), pfc and dc/dc blocks stop. a detection timer t comp (typ.150us) is built inside to prevent detect ion errors caused by noise. the stop mode is latched. the comp pin is pulled up in rcomp (typ.25.9k ), if the comp pin is pulled down with a resistance value lower than r t (3.70k .typ), the ic will detect the abnormality. an application example is shown in figure 9, 10, 11. overheating protection by ntc thermistor a thermistor is attached to the comp pin so t hat latching can be stopped when overheating occurs. in the case of this application, it should be de signed so that the thermi stor resistance becomes r t (typ.3.70k ) when overheating is detected. (figure 9, 10, 11 are application circuit exampl es in which latching occurs when ta = 110c.) comp + - r latch (typ25.9k) vref v latch (typ0.5v) ntc thermistor 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 20.0 0 20 40 60 80 100 120 140 160 180 200 resister value r [k ] temparature t[ ? ] r t t(typ3.7k ) detect figure 9. comp pin overheating prot ection application figure 10. temperature-thermistor resistance value characteristics secondary output voltage overvoltage protection a photocoupler is attached to the comp pin to per form detection of secondary output overvoltage. vo comp + - typ25.9k BM1C001F figure 11. output overvoltage protection application
datasheet datasheet 8/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (5) br pin the br pin has three functions as shown in figure 12. function 1: low ac voltage protection. (blown in/out) function 2: detects ac voltage and discharges by vh_in pin. function 3: detects ac input voltage, whether 240v or 100v, by the amplitude level input to the br pin the output voltage of the pf" and voltage level of the cs over-current detection are switched to ac240v or ac100v based systems. (pfc output = ac100v: 260v, ac240v:400v) the input to the br pin is the full-wave / half-wave rectifie d ac waveform of 50hz/60hz voltage divided by resistance. in addition, in order to stabilize the input waveform, the capacitor (1000pf to 0.01uf) must be conn ected close to the br pin. (5-1) low ac voltage protection (blown in/out) when ac voltage is too low, blown out function can stop the pfc block and qr block. the ac input voltage connects to the br pin through two divider resistors. when the voltage of the br pin is higher than v br (1.0vtyp), normal status is detected and dc/dc starts. after dc/dc started, low voltage in br pin ca n stop pfc and dcdc blocks when it`s lower than v br (typ.1.0v)and maintains the level for longer than t br (typ.256ms). (5-2) x capacitor discharge function when ac voltage drop is detected after t br (typ.256ms), discharge function becomes possible. discharge happens when vcc recharge function works. fuse ac 85-265 vac ac monitor discharge figure 12. blown in/out application circuits (1) if the ac input voltage drops, output is stopped if for more than 256ms the br terminal voltage is lower than 1.0v. in this case, xcap discharge function operates. (2) if the ac input voltage is lost, it was a low voltage, output will be stopped in 256ms after the point where the br terminal voltage drops to 1.0v or less. in this case, xcap discharge function operates. (3) if the ac input voltage is lost, it becomes a high voltage, output will be stopped in 256ms after the point where the br terminal voltage rises to 0.75v or more. in this case, xcap discharge function operates. figure 13. br pin timing chart
datasheet datasheet 9/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (5-3) pfc output voltage switching function for ac input voltage that varies by region, in order to be as constant as possible boosting ratio by changing the pfc output voltage, pfc is switching the output voltage by ac240v or ac100v-based systems. thereby, pfc output voltage is changed from 400v to 260v in the case of ac100v-based input. as a result, efficiency is improved. this feature will detect if the system is ac240v or ac100v based in number and voltage level of the ac waveform that is input to the br pin. (refer to figure 14). see the timing chart of figure 15, if the waveform (voltage higher than the voltage detection acin (th.=2.5v)) of 9 cycles is entered continuousl y, the pfc determines the ac240v system. in that case, pfc changes the gm amplifier reference and t he pfc output is changed to 400v from 260v. figure 14. pfc output voltage switching function fi gure 15. pfc output voltage switching timing chart
datasheet datasheet 10/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (6) the quasi-resonant dc/dc driver the ic operates with pfm (pulse frequency modulation) mode method. by monitoring the qr_fb pin, qr_ zt pin, and qr_ cs pin, the ic supplies optimum system for dc/dc operation. the ic controls on width (turn off) of external mosfet by qr_fb pin and qr_cs pin. the ic controls off width (tur n on) of external mosfet by qr_zt pin. the details are shown below. (refer to figure 16) nout on timer (256ms) + - 100mv /200mv 1 shot 7v and zt blanking out(h->l) 0.60us nout and pre driver pout fb/4 fb/5.71 + - - ac100v:0.50v ac240v:0.35v current sense (v-v change) normal : 1.0 + - fbolp_oh 0.5v + - osc 300k 100k or or 30k ss 1ms ss 4ms + - s q r nout 12v clamp circuit 1m ss 2ms ss 0.5ms set reset 2.8v/2.6v off timer (2048ms) osc fbolp_oh and and timeout 15 usec 5 usec soft start leading edge blanking max frequency control figure 16. dc/dc block diagram
datasheet datasheet 11/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (6-1) determination of on width (turn off) on width is controlled by qr_fb and qr_cs. the ic decides on width by comparison between the value which divide qr_fb pin by v cs (typ=4) voltage and qr_cs pin voltage. besides, by comparison with vlim1(typ.0.5v)voltage which is generated in ic, qr_cs comparator level is changed linearly to be shown in figure 17. qr_cs is shared with over-current limiter circuit per pulse. ic changes over-current limiter level and max frequency by qr_ fb voltage. mode1: burst operation mode2: frequency reduction operation (reduce max frequency) mode3: max frequency operation mode4: over load operation (to detect ov er load state, ic stops switching) qr_fb [v] max fsw [khz] 0.5v 1.25v 40khz 120khz 0.0v 2.0v mode1 mode2 mode3 2.8v mode4 qr_fb [v] cs limiter [v] 0.5v 1.25v vlim2 vlim1 0.0v 2.0v mode1 mode2 mode3 2.8v mode4 figure 17. qr_fb pin voltage ? over-current limiter, max frequency characteristics to adjust over-current limiter level, cs over-current protection voltage is switched in soft-start, ac voltage. vlim1 and vlim2 are changed below. table 2. over-current protection voltage detail ac=100v ac=240v soft start vlim1 vlim2 vlim1 vlim2 start to 0.5ms 0.063v ( 12%) 0.016v ( 3%) 0.044v (10%) 0.011v ( 2%) 0.5ms to 1ms 0.125v ( 25%) 0.032v ( 6%) 0.088v (20%) 0.022v ( 4%) 1ms to 2ms 0.250v ( 50%) 0.063v (12%) 0.175v (40%) 0.044v ( 9%) 2ms to 4ms 0.375v ( 75%) 0.094v (19%) 0.263v (60%) 0.066v (13%) 4ms ? 0.500v (100%) 0.125v (25%) 0.350v (70%) 0.087v (18%) * ( percent) is shown comparative value wi th vlim1(typ =0.5v)in normal operation. the reason that distinguish between ac100v and ac230v is by cs over-current protection voltage sw itch function which is shown to(6-3).
datasheet datasheet 12/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (6-2) leb (leading edge blanking) function when a mosfet for switching is turned on, surge current occurs because of capacitance or rush current. therefore, when qr_cs voltage rises temporarily, the over-current limi ter circuit may result to miss detections. to prevent miss detections, the ic has a built-in blanking function which masks for t leb (typ.250ns) from switching qr_out pin from l to h. this blanking function enables to reduce noise filter of qr_cs pin. (6-3) qr_cs pin over-current protection switching function when input voltage (vh_in) is higher, on time is short, and t he operating frequency increases. as a result, maximum capable power increases for constant over-current limiter. for that while monitoring input voltage (vh_in) the ic switches the over-current detection of the ic. in case of high voltage (ac230v), ic changes over-current comparator level to 0.7 multiple o f normal level. (6-4) determination of off width (turn on) off width is controlled at the qr_zt pin. when qr_out is low, the power stored in the coil is supplied to the secondary-side output capacitor. when this power supply ends, there is no more current flowing to the secondary side, so the drain pin voltage of switching mosfet dr ops. consequently, the voltage on the auxiliary coil side also drops. a voltage that wa s resistance-divided by rzt1 and rzt2 is applied to qr_zt pin. when this voltage level drops to v zt1 (typ.100mv) or below, mosfet is turned on by the zt comparator. since zero current status is detected at the qr _zt pin, time constants are generated using czt, rzt1, and rzt2. additionally, a zt trigger mask function (described in section 6-5) and a zt timeout function (described in section 6-6) are built in ic. in addition, voltage auxiliary winding voltage (vs) becomes negative while the switching is on, there is a possibility that the surge voltage negative is input to the pin qr_zt during the switching timing. for this reason, to avoid of-0.3v contact rating below, please connect a schottky diode between the pin and gnd. (refer to figure 16) (6-5) zt trigger mask function (figure 18) when switching is set from on to off, superposition of noise may occur at the qr_zt pin. then, the zt comparator and ztov p comparator are masked for the t ztmask time to prevent zt comparator operation errors. figure 18. the function of qr_zt trigger mask. a: dc/dc off => on b: dc/dc on => off c: since a noise occurs to qr_zt pin at b, ic masks zt comparator and ztovp comparator detection for t ztmask time.
datasheet datasheet 13/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (6-6) zt timeout function (figure 19) (6-6-1) zt timeout function 1 when qr_zt pin voltage is not higher than v zt2 (typ=200mv) for t ztout1 such as start or low output voltage, qr_ zt pin shorts to ground and ic turns on mosfet by force. (6-6-2) zt timeout function 2 after zt comparator detects low voltage level, when ic does not detect a following low voltage level within t ztout2 , ic turns on mosfet by force. after zt comparator detects bottom at once, the function operates. for that, it does not operate at start or a t low output voltage. when ic is not able to detect low voltage leve l by decreasing auxiliary coil voltage, the function operates . qr_out qr_cs bottom detection signal qr_zt v zt2 zt pin ? gnd short happen 5us time out t ztout1 a bc d e fgh i 15us time out v zt1 t ztout1 t ztout2 t ztout2 figure 19. the function of zt time out. a: when starting, ic starts to operate by zt timeout function1 for qr_zt=0v. b: mosfet turns on c: mosfet turns off d: qr_zt voltage is lower than v zt2 (typ.200mv) by qr_zt dump decreasing. e: mosfet turns on by zt timeout fucntion2 after t zt2 (typ.5us) from d point. f: qr_zt voltage is lower than v zt2 (typ.200mv) by qr_zt dump decreasing. g: mosfet turns on by zt timeout fucntion2 after t zt2 (typ.5us) from f point. h: qr_zt pin is short to gnd. i : mosfet turns on by zt timeout function1 after t ztout1 (typ.15us) .
datasheet datasheet 14/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (6-7) soft start sequence normally, when ac voltage is applied there is a large amount of current flow then secondary the output voltage and current overshoot. to prevent it, the ic has a built-in soft-s tart function. when vcc pin voltage is lower than v uvlo2 (typ.8.2v), ic is reset. after that, when ac voltage is applied, the ic operat es soft-start. the soft start function is shown below: start to 0.5ms => set qr_cs limiter to 12.5% of normal operation. 0.5ms to 1ms => set qr_cs limiter to 25% of normal operation. 1ms to 2ms => set qr_cs limiter to 50% of normal operation. 2ms to 4ms => set qr_cs limiter to 75% of normal operation. 4ms ? => normal operation (6-8) qr_zt ovp (over voltage protection) the built-in ovp function to qr_zt of the ic has a protecti on type that is latch mode. ztovp corresponds to dc voltage detection and pulse detection for qr_zt pin. when the qr_zt pin voltage is over v ztl (typ=5.0v), ic starts to detect ztovp function. to prevent zt ovp from miss-detecting by surge noise, ic builds in 3count and t latch (typ=100us) timer. zt ovp function operates in all states (normal st ate and over load state and burst state) after t ztmask (0.6us). for pulse detection, zt ovp operation starts detection after t ztmask delay time from qr_out: h->l qr_out qr_zt v zt2 zt ovp comparator zt ovp detect 12 3 tztmask tztmask tztmask tztmask tztmask tztmask t latch (typ=100us) latch stop ab c d v zt1 figure 20. the function of latch mask and zt ovp a: when qr_out voltage is changed from h to l, qr_z t voltage is up. then, surge pulse occurs to qr_zt. for that, because ic builds in t ztmask time (typ=0.6us), ic does not detect ztovp for t ztmask time. b: ic detects ztovp after t ztmask time (typ=0.6us) when qr_zt voltage > 5.0v. c: when ztovp comparator counts 3 pulse, t latch timer (typ=100us) operates. d: when it takes for 100us from c, ic det ects zt ovp and ic carries out latch stop. (6-9) qr_cs open protection when qr_cs is open, to prevent qr_out pin from changing to h by noise, ic builds in cs open protection. when qr_cs is open, qr_out switching is stopped by the function. (this is auto-recovery.) nout leading edge blanking and pout current sense (v-v change) normal : 1.0 fbolp_oh s q r 1m vccovp or and timeout bottom det pre driver figure 21. qr_cs open protection circuit.
datasheet datasheet 15/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (6-10) output over load protection (fb olp comparator) when secondary output is at over load, ic detects it by fb olp, then the ic stops switching. in olp state, because the secondary photo-coupler has no current flow, qr_fb voltage is up. when the condition continues for t folp (typ =256ms), ic judges over load state, qr _out is fixed to low. after qr_fb voltage is over v folp1a (typ =2.8v), when qr_fb voltage is lower than v folp1b (typ =2.6v) within t folp (typ =256ms), over load protection timer is reset. in starting, because qr_fb is pull-up by a resistor to internal voltage, qr_fb voltage starts to operate in the state which is more than v folp1a (typ =2.8v). for that, please set the stable time of secondary output voltage within t folp (typ =256ms). after detecting over load, ic is stopped for t olpst (typ =2048ms), ic is on auto-recovery operation. in stopping switching, though vcc voltage is not charged from au xiliary coil side, ic operates re-charge function from starter circuit, vcc voltage keeps vcc pin voltage > v uvlo2 . figure 22. auto restart operation by over load protection. a: when qr_fb voltage is over v folp1a (typ.2.8v), fbolp comparator detects over load. b: when the state a continues for t folp (typ.256ms), ic stops switching by over load protection. c: during stopping switching by over load protecti on, vcc voltage drops. when vcc voltage is lower than v chg , vcc re-charge function operates, vcc voltage is up. d: when vcc voltage is higher than v chg2 by re-charge function, vcc recharge function is stopped. e: from b, it takes for t olpst (typ.2048ms), ic starts switching with soft-start. f: when over load state continues, qr_fb voltage is over v folp1a . when it takes for t folp (typ.256ms) from e, ic stops switching. g: during stopping switching by over load protection, vcc voltage drops. when vcc voltage is lower than v chg1 , vcc re-charge function operates, vcc voltage is up. h: when vcc voltage is higher than v chg2 by re-charge function, vcc recharge function is stopped. (6-11) qr_out pin voltage clamp function for the purpose of protecting the external mo sfet, h level of qr_out is clamped to v outh (typ.12.5v) it prevents gate destruction of mosfet by rising vcc voltage. (refer to figure 20) qr_out is pull-down r pdout (typ.100k ). figure 23. the simple circuit of qr_out pin. 256ms 256ms 2048ms 2048ms
datasheet datasheet 16/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (7) power factor correction (pfc: power factor correction) part ? the power factor correction circuit is a voltage cont rol method with the pfm boundary conduction mode. the operation circuit is shown is figure 24 and timing chart is shown in figure 25. switching operation (1) inductor current (i l ) increases after mosfet changes to on. (2) the slope set by p_rt is compared with v p_eo when mosfet is turned on, i l increases current. (3) mosfet is set to be on after p_is terminal detects at the zero point. figure 24. the operation circuit of pfc. ??? figure 25. the switching timing chart. (7-1) gmamp p_vs pin monitors a voltage divided level between resistors of output voltage. p_vs pin has the piled up ripple voltage of ac frequency (50hz/60hz). the gmamp filters this ripple voltage and controls the voltage level of p_eo, by responding to error of p_vs pin voltage and internal reference voltage v p_vsamp (typ.2.5v (1.625v) ). please set cut-off frequency of filter at p_eo pin showed in figure 26, to about 5~10hz. gm constant is designed 44ua / v. figure 26. the block diagram of gmamp. p_eo
datasheet datasheet 17/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (7-2) p_vs short protection the pfc built-in short protection function at p_vs works by stopping switching at p_out when p_vs voltage < v p_short (typ:0.3v/0.195v: -92% voltage of pfc output). the oper ation is shown is figure 27. figure 27. the short protection of p_vs terminal.. (7-3) gain boost function in p_vs low voltage there are instances where dropping of output voltage by sudden load changes happens, because of slow pfc voltage response, output voltage is low for a long time. therefore, pf c speeds up voltage control loop gain when p_vs pin voltage is low around v pgup (typ.2.25v) (output voltage - 10%). in the operation, on-duty at p_ou t pin increases, pfc prevents output voltage from dropping for a long time. this operation is stopped when p_vs pin voltage is higher than v gup (typ.2.25v). (7-4) gain decrease function in p_vs over voltage (dynamic ovp) in case the output voltage is high by starting up or su dden output load changes, and because pfc voltage response is slow, output voltage is high for a long time. therefore, pfc speeds up voltage control loop gain when p_vs pin voltage is high around v p_ovp1 (typ.2.625). in this operation, on-duty at p_out pin decreases, pfc prevents output voltage from rising for a long time. this operation is stopped when p_vs pin voltage is lower than vp_ovp1(typ.2.625v). (7-5) p_vs over voltage protection function (static ovp) pfc has a second built-in over voltage protection, for the ca se that p_vs voltage exceeds over the first over voltage protection voltage v p_ovp1 . in case of auto recovery, p_vs pin voltage is exceeded v p_ovp2 (typ.2.725v), switching is stopped instantly. when p_vs pin voltage decrease lower than v p_ovp2 (typ.2.725v), switching operation is re-start. refer to figure 28. figure 28. p_vs over voltage protection (auto restart mode).
datasheet datasheet 18/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (7-6) p_ovp terminal over voltage protection function p_ovp terminal has over voltage protection function to avoid p_ovp voltage increasing more than v p_ovp2 when p_vs feedback circuit is under abnormal condit ion and to stop pfc output (latch mode). ic stops switching (latch mode) after timer count (16ms), p_ovp increases more than v p_ovp3 (typ.2.5v). because of the timer, ic avoids detection error. the operation is shown is figure 30. figure 29. the protection of p_povp terminal(latch mode). figure 30. timing chart (7-7) the p_is terminal zero current detection and over-current detection function zero current detection circuit is used to sens e the zero crossing of inductor current (il). p_out output is set to be low after zero detection delay bec ause p_is voltage becomes more than zero current detection voltage. the over-current detection of an inductor current is set to be v th =-0.6v (typ) of p_is voltage. to remove switching noise, we recommend additional cr filter in p_is pin. the operation is shown is figure 32. p_is p_out - + -10mv -0.6v delay over current protection driver logic - + figure 31. current detection circuit of p_is terminal p_out p_is -10mv t zcdd figure 32. p_is zero current detection delay time
datasheet datasheet 19/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (7-8) p_rt terminal the frequency of the triangle waveform is generated by the oscillat or block by external resistor on r_rt. the relationship of rt value and frequency is shown in figure 34. the maximum on wi dth is calculated by the following expression on application. = 2 _ 2 ][ acmin o maxon v pl st v ac : input power inductor: l max output power(w) efficiency we recommend that the period set by p_rt te rminal is to be more than max on width (t on_max ). also, to improve efficiency in light load mode, rising frequency is controlled by the frequency set by p_rt. so the range of setting frequency is 400khz(typ). external resistance range on the rt pin is 82k 390k . rt terminal can also set delay time from the zero-crossing detection (vth=-10mv) comparator output change point. (refer to figure 35). vcc=15v 0 10 20 30 40 50 60 0 100 200 300 400 500 rt [k] pfc osc max on width [us] vcc=15v 0 100 200 300 400 500 600 700 800 900 0 100 200 300 400 500 rt [k] pfc osc max osc frequency [khz] figure 33. the relationship of rt and operation frequency* figure 34. the relationship of rt and on width* vcc=15v 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 100 200 300 400 500 rt [k] pfc zero current detection delay [us] figure 35. the relationship of rt and pfc zero current detection delay* *the above chart is for reference only. after confirmati on of the actual device, please set the constant.
datasheet datasheet 20/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F (7-9) pfc off configuration function figure 36 shows the operation circuit and figure 37 shows ti ming chart. this function can be used to stop pfc block and to improve efficiency of the system for light load. the light load is detected when qr_fb`s voltage is low. the p_timer pin sets timer by capacitor?s value to pfc stopping output from light load condition detection. when qr_fb`s voltage is lower than p_offset`s voltage in bm 1c001f, the capacitor of p_timer pin starts to charge. when p_timer`s voltage is higher than 2.0v (typ), p_out is stopped. when qr_fb`s voltage is higher than p_offset`s voltage, p_out starts again (auto restart). for the stabilization of p_offset pi n voltage, connect a capacitor (1000pf ? ) between the pin and gnd. in addition, there is a need to connect a 140k ? 400k resistance to be connected to the p_offset pin. figure 36. operation circuit figure 37. timing chart
datasheet datasheet 21/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F operation mode of protection circuit operation mode of protection f unctions are shown in table 3. table 3. operation mode of protection circuit. operation mode item comments detection method operation at detection release method operation at release vccuvlo vcc pin low voltage protection vcc<8.2v vcc falling pfc part, dc/dc part stop vcc>13.5v vcc rising pfc part, dc/dc part start up operation vccovp vcc pin over voltage protection vcc>27.5v during 100us vcc rising pfc part, dc/dc part latch stop vcc<7.7v vcc falling pfc part, dc/dc part start up operation brown out (pfc) input ac voltage low voltage protection br 1.0v during 256ms br falling pfc part stop, x-cap disharging br>1.0v br rising normal operation brown out (qr) input ac voltage low voltage protection br 1.0v during 256ms br falling dc/dc part stop br>1.0v br rising normal operation comp comp pin protection comp<0.5v during 150us comp falling pfc part, dc/dc part latch stop vcc<7.7v vcc falling pfc part, dc/dc part start up operation qr_fb_olp qr_fb pin over-current protection qr_fb>2.8v during 256ms qr_fb rising dc/dc part stop qr_fb<2.6v during 2048ms qr_fb falling normal operation qr_zt ovp qr_zt pin over voltage protection qr_zt>5.0v during 100us qr_qr_zt rising dc/dc part latch stop vcc<7.7v vcc falling normal operation p_is ocp p_is pin short protection p_is<-0.60v p_is falling pfc part output stop p_is>-0.60v p_is rising normal operation p_vs short protection 1 p_vs pin short protection p_vs<0.3v p_vs falling pfc part operation stop p_vs>0.3v p_vs rising normal operation p_vs gain boost p_vs pin low voltage gain boost function p_vs<2.25v p_vs falling gm-amp. gain boost p_vs>2.25v p_vs rising normal operation p_vs dovp p_vs pin dynamic over voltage protection p_vs>2.625v p_vs rising gm-amp. gain down p_vs<2.625v p_vs falling normal operation p_vs sovp p_vs pin static over voltage protection p_vs>2.725v p_vs rising pfc part stop p_vs<2.6v p_vs falling normal operation p_ovp ovp p_ovp pin over voltage protection p_ovp>2.5v p_vs rising pfc part, dc/dc part latch stop vcc<8.2v vcc falling pfc part, dc/dc part start up operation p_timer p_timer pin protection function p_timer>2.0v p_timer rising pfc part stop fb>p_offset (fb rising) normal operation
datasheet datasheet 22/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F absolute maximum ratings (ta = 25c) parameter symbol rating unit conditions maximum applied voltage 1 v max1 -0.3 to +30.0 v vcc maximum applied voltage 2 v max2 -0.3 to +650 v vh_in maximum applied voltage 3 v max3 -0.3 to +15.0 v p_out, qr_out maximum applied voltage 4 v max4 -0.3 to +6.5 v qr_fb, comp, p_vs, br, p_ovp, p_rt, p_offset, p_vs, qr_cs, p_timer maximum applied voltage 5 v max5 -0.3 to +7.0 v qr_zt maximum applied voltage 6 v max6 -6.5 to +0.3 v p_is p_out pin output peak current 1 i p_out1 -0.5 a p_out pin output peak current 2 i p_out2 +1.0 a qr_out pin output peak current 1 i qr_out1 -0.5 a qr_out pin output peak current 2 i qr_out2 +1.0 a allowable dissipation p d 0.68 (note1) w mounted operating temperature range t opr -40 to +105 c storage temperature range t str -55 to +150 c (note1) derate by 5.5 mw/c when operating above ta = 25c when mounted (on 70 mm 70 mm, 1.6 mm thick, glass epoxy on single- layer substrate). caution : operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta = 25 c ) parameter symbol rating unit conditions power supply voltage range 1 v cc 8.9 to 26.0 v vcc pin voltage power supply voltage range 2 v h 80 to 600 v vh_in pin voltage recommended external parts (ta = 25 c ) parameter symbol rating unit vcc pin capacitor c vcc 1.0 f br pin capacitor c br 0.1 to 100 nf p_rt pin resistor r p_rt 82 to 390 k ? p_offset pin capacitor c p_offset 1000 pf p_offset pin resistor r p_offset 140 (400) k ?
datasheet datasheet 23/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F electrical characteristics (unless otherwise noted, ta=25c, vcc=15v) specifications parameter symbol minimum standard maximum unit conditions [ circuit current ] circuit current (on) 1 i on1 - 1.0 1.4 ma pfc=off qr_fb=2.0v (during pulse operation) circuit current (on) 2 i on2 - 1.2 1.7 ma pfc=on qr_fb=2.0v (during pulse operation) circuit current (on) 3 i on3 - 600 780 a poff=off fb=0.0v (during burst operation) [ start-up circuit block ] start current 1 i start1 0.4 0.7 1.0 ma vcc= 0v start current 2 i start2 1 3 5 ma vcc=10v off current i start3 - 10 20 a input current from vh _in terminal after releasing uvlo vh voltage switched start current v sc 0.8 1.5 2.1 v [ vcc pin protection function ] vcc uvlo voltage1 v uvlo1 12.5 13.5 14.5 v vcc rise vcc uvlo voltage 2 v uvlo2 7.5 8.2 8.9 v vcc drop vcc uvlo hysteresis v uvlo3 - 5.3 - v v uvlo3 =v uvlo1 -v uvlo2 vcc charge start voltage v chg1 7.7 8.7 9.7 v start circuit operation voltage vcc charge end voltage v chg2 12 13 14 v stop voltage from v chg1 vcc ovp voltage 1 v ovp1 26.0 27.5 29.0 v vcc rise [ br pin (7pin) ] br detect voltage1 v br1 0.92 1.00 1.08 v br rise br detect voltage 2 v br2 - 0.70 - v br fall br hysteresis v brhys - 0.30 - v br timer t brtimer 204 256 307 ms pfc, dcdc stop, discharge start acin detect voltage v acin1 2.25 2.50 2.75 v [ comp pin (5pin) ] comp pin detect voltage v comp 0.37 0.50 0.63 v comp pin pull-up resistor r comp 19.4 25.9 32.3 k ? thermistor resistor detection value r t 3.32 3.70 4.08 k ? latch release voltage (vcc pin voltage) t brtimer - v uvlo -0.5 - v latch mask time t comp - 150 240 s
datasheet datasheet 24/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F electrical characteristics ? continued (unless otherwise noted, ta=25 , vcc=15v) specifications parameter symbol minimum standard maximum unit conditions [ p_offset block] p_offset source current 1 i _offset1 3.6 4.0 4.4 a p_offset source current 2 i _offset2 4.5 5.0 5.5 v p_offset setting voltage v p_offset 0.50 0.64 0.78 a p_offset pin = open p_offset setting voltage hys v p_offset hys 0.12 0.16 0.20 v p_offset pin = open [ p_timer pin ] p_timer source current i _ptimer 1.6 2.0 2.4 a p_timer detection voltage v p_timer 1.9 2.0 2.1 v p_timer rise [ pfc part gm amplifier block ] p_vs pin pull-up current i _p_vs - 0.5 - a gm amp. normal voltage 1 v p_vsamp1 2.46 2.50 2.56 v gm amp. normal voltage 2 v p_vsamp2 1.544 1.625 1.706 v gm amp. trans conductance t p_vs 30.8 44.0 59.2 a/v maximum gm amplifier source current i p_eo_source 15 25 35 a p_vs=1.0v maximum gm amplifier sink current i p_eo_sink 24 40 56 a p_vs=3.5v [ pfc part osc block ] maximum on width t maxduty 24 30 36 s rt=220k
maximum oscillation frequency f maxduty 320 400 480 khz rt=220k
[ pfc part osc block ] zero current detection voltage v zcd -15m -10m -5m v zero current detection voltage delay t zcdd - 0.85 1.70 s is over-current detection voltage v is_ocp -0.625 -0.600 -0.575 v [ pfc part protection block ] figure of ( ? %) is the ratio of vs standard voltage (1: 2.5v, 2:1.625v). p_vs short protection voltage1 v p_short1 0.200 (-92%) 0.300 (-88%) 0.400 (-84%) v acin=h p_vs short protection voltage2 v p_short2 0.130 (-92%) 0.195 (-88%) 0.260 (-84%) v acin=l p_vs gain rise voltage1 v pgup1 2.050 (-18%) 2. 250 (-10%) 2.450 (-2%) v acin=h p_vs gain rise voltage2 v pgup2 1.332 (-18%) 1.462 (-10%) 1.593 (-2%) v acin=l p_vs gain fall voltage 1 v p_ovp1 - 2.625 (+5%) - v acin=h p_vs gain fall voltage 2 v p_ovp2 - 1.706 (+5%) - v acin=l p_vs over voltage protection detection voltage1 (auto recovery) v p_ovp1 - 2.725 (+9%) - v acin=h p_vs over voltage protection detection voltage2 (auto recovery) v p_ovp2 - 1.771 (+9%) - v acin=l [ pfc part ovp block ] pfc ovp pin detection voltage v comp 2.43 2.50 2.57 v pfc ovp pin detection timer t pfcovp - 100 200 sec [ pfc part out block ] p_out pin h voltage v outh 10.5 12.5 14.5 v io = -20ma p_out pin l voltage v outl - - 1.00 v io = +20ma p_out pin pull down resistor r pdout 75 100 125 k ? * definition of acin (l : br pin voltage < 2.5v, h : br pin voltage > 2.5v)
datasheet datasheet 25/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F electrical characteristics ? continued (unless otherwise noted, ta=25 , vcc=15v) specifications parameter symbol minimum standard maximum unit conditions [ dc/dc convertor block (turn off) ] fb pin pull-up resistor r fb 22.5 30.0 37.5 k ? cs over-current detect voltage 1a v lim1a 0.475 0.500 0.525 v fb=2.2v (acin=l) cs over-current detect voltage 1b v lim1b 0.310 0.350 0.390 v fb=2.2v (acin=h) cs over-current detect voltage 2a v lim2a 0.100 0.125 0.150 v fb=0.5v (acin=l) cs over-current detect voltage 2b v lim2b 0.062 0.088 0.113 v fb=0.5v (acin=h) voltage gain 1 ( ?vfb/ ? vcs) av cs1 3.40 4.00 4.60 v/v acin=l voltage gain 2 ( ?vfb/ ? vcs) av cs2 4.86 5.71 6.57 v/v acin=h cs leading edge blanking time t leb - 0.250 - s turn off time t off - 0.250 - s pulse is applied to cs pin minimum on width t min - 0.500 - s t leb + t off maximum on width t max 29.0 43.0 57.2 s [ dc/dc convertor block (turn off) ] maximum operating frequency 1 f sw1 108 120 132 khz fb=2.0v maximum operating frequency 2 f sw2 22 30 39 khz fb=0.5v frequency reduction start fb voltage v fbsw1 1.10 1.25 1.40 v frequency reduction end fb voltage v fbsw2 0.45 0.50 0.55 v zt comparator voltage 1 v zt1 60 100 140 mv zt fall zt comparator voltage 2 v zt2 120 200 280 mv zt rise zt trigger mask time t ztmask - 0.6 - s out h to l, for protection noise zt trigger timeout period 1 t ztout1 11.7 17.5 23.2 s the operation without bottom detection zt trigger timeout period 2 t ztout2 3.9 5.8 7.7 s count from final zt trigger [ dc/dc convertor blo ck (protection) ] soft start time 1 t ss1 0.35 0.50 0.65 ms soft start time 2 t ss2 0.70 1.00 1.30 ms soft start time 3 t ss3 1.40 2.00 2.60 ms soft start time 4 t ss4 2.80 4.00 5.20 ms fb burst voltage 1 v burst1 0.435 0.500 0.565 v fb fall fb burst voltage 2 v burst2 0.479 0.550 0.621 v fb rise fb olp voltage a v folp1a 2.6 2.8 3.0 v over load detection (fb fall) fb olp voltage b v folp1b - 2.6 - v over load detection (fb rise) fb olp detection timer t folp 197 256 333 ms fb olp stop timer t olpst 1433 2048 2664 ms latch release voltage (vcc pin voltage) v latch - v uvlo2 ? 0.50 - v latch mask time t latch 50 100 200 s zt ovp voltage v ztl 4.64 5.00 5.36 v [dc/dc out block] qr_out pin h voltage v qrouth 10.5 12.5 14.5 v io=-20ma qr_out pin l voltage v qroutl - - 1.00 v io=+20ma qr_out pin pull-down res. r qrdout 75 100 125 k ? * definition of acin (l : br pin voltage < 2.5v, h : br pin voltage > 2.5v)
datasheet datasheet 26/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F power dissipation the thermal design should set operation for the following conditions. (since the temperature shown below is the guaranteed tem perature, be sure to take a margin into account.) 1. the ambient temperature ta must be 105c or less. 2. the ic?s loss must be within the allowable dissipation pd. the thermal abatement characteristics are as follows. (pcb: 70 mm 70 mm 1.6 mm, m ounted on glass epoxy substrate) 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0 25 50 75 100 125 150 ambient temperature : ta [ ? ] power dissipation : pd [w] figure 38. thermal abatement characteristics
datasheet datasheet 27/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F i/o equivalence circuits 1 vcc 2 gnd 3 qr_fb 4 qr_zt 5 comp 6 p_eo 7 br 8 p_rt 9 p_offset 10 p_ovp 11 p_vs 12 qr_cs 13 p_is 14 p_out 15 qr_out 16 p_timer 17 (n.c.) 18 vh_in n. c. internal reg internal reg internal reg internal circuit internal reg internal reg internal reg internal reg internal reg figure 39. i/o equivalent circuit diagram
datasheet datasheet 28/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, ev en during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consider ation to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
datasheet datasheet 29/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F operational notes ? continued 11. unused input terminals input terminals of an ic are often con nected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. figure 40. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in pr eventing damage due to sudden and unexpecte d incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority
datasheet datasheet 30/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F ordering information b m 1 c 0 0 1 f - g e 2 part number package f:sop18 packaging and forming specification g: halogen free e2: embossed tape and reel marking diagrams part number marking package orderable part number BM1C001F sop18 BM1C001F-ge2 sop18(top view) 1234567890 part number marking lot numbe r 1pin mark
datasheet datasheet 31/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F physical dimension, tape and reel information package name sop18 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop18 drawing no. : ex115-5001 (max 11.55 (include.burr))
datasheet datasheet 32/32 tsz02201-0f1f0a200010-1-2 ? 2013 rohm co., ltd. all rights reserved. 29.aug.2013 rev.002 www.rohm.com tsz22111 ~ 15~ 001 BM1C001F revision history date revision changes 5.aug.2013 001 new release 28.aug.2013 002 page25. maximum on width: 30 / 42 / 54 -> 29.0 / 43.0 / 57.2 us zt trigger timeout period 1: 10.5 / 15.0 /19.5 -> 11.7 / 17.5 / 23.2 us zt trigger timeout period 2: 3.5 / 5.0 / 6.5 -> 3.9 / 5.8 / 7.7 us fb burst voltage 1: 0.450 / 0.5 00 / 0.550 -> 0.435 / 0.500 / 0.565 v fb burst voltage 2: 0.495 / 0.5 50 / 0.605 -> 0.479 / 0.550 / 0.621 v page22. absolute maximum ratings: ?caution? and ?p_ovp? pin added. others: each figure appearance modification.
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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